Centered on high multilayer, high-frequency high-speed, HDI and specialty boards, we cover 8 major categories of high-end PCB products. All board types support expedited prototypes and extension to small/medium volumes; capability parameters are detailed in each section below.
Built for the high layer counts, large sizes and thick boards of AI servers, communication backplanes and industrial mainboards. Stable lamination registration, precise impedance control and mature back-drilling processes ensure hole-wall quality and signal consistency at high aspect ratios.
| Capability item | Specification range |
|---|---|
| Layer count range | 4 – 32 layers |
| Finished board thickness | 0.4 – 8.0 mm |
| Max. fabrication size | 610 × 1100 mm |
| Min. line width / spacing | 3 / 3 mil (2 / 2 mil for HDI) |
| Min. finished hole diameter | Mechanical holes 0.15 mm |
| Max. aspect ratio | 20:1 (25:1 for backplane structures) |
| Impedance control | ±8% (±10% standard) |
| Surface finish | ENIG / immersion silver / immersion tin / OSP / HASL / hard gold |
Serving high-frequency high-speed links such as 800G/1.6T optical modules, 5G communications and radar. Low-loss materials, hybrid lamination and metal-base composites — combined with line width precision and copper foil roughness control — keep insertion loss within the design window.
| Capability item | Specification range |
|---|---|
| Common materials | Rogers, Taconic, Arlon, Panasonic, TUC, Wangling |
| Build-up structure | Single material / hybrid lamination / metal-base composite |
| Max. layers | 16 layers |
| Line width precision | ±8 μm |
| Gold finger dimensional deviation | ±0.075 mm |
| Signal transmission rate | ≤ 100 Gbps per channel (supports 112G / 224G PAM4 link design) |
| Surface finish | ENIG / OSP / immersion tin / HASL |
| Special processes | Blind/buried vias, via-in-pad, hybrid lamination |
High-density interconnect via laser blind vias, mechanical buried vias and via-in-pad frees routing space for accelerator cards, optical modules and compact terminals. 1–3 step structures and stacked vias meet high-IO-density and short-interconnect design needs.
| Capability item | Specification range |
|---|---|
| HDI build-up stages | 1 – 3 stages |
| Min. laser blind via diameter | 0.10 mm |
| Min. mechanical drill diameter | 0.15 mm |
| Min. line width / spacing | 2 / 2 mil |
| Board thickness range | 0.4 – 3.0 mm |
| Via types | Through / blind / buried / via-in-pad / stacked vias |
| Via filling methods | Resin plugging / electroplated via filling (POFV) |
| Layer-to-layer registration accuracy | ±0.05 mm |
Designed for power busbars, power devices and NEV control electronics. 1–13 OZ heavy copper carries high currents while high-TG materials improve heat resistance and dimensional stability; combinations of outer heavy copper and base copper meet demanding current and thermal requirements.
| Capability item | Specification range |
|---|---|
| Copper thickness range | 1 – 13 OZ (outer base copper up to 18 OZ) |
| Base material Tg | Tg 150 / 170 / 180 ℃ |
| Board thickness range | 0.6 – 8.0 mm |
| Min. line width / spacing | ≥ 4 / 4 mil (adjusted with copper thickness) |
| Max. layers (heavy copper structures) | 16 layers |
| Product certifications | UL / RoHS |
| Special processes | Local heavy copper, buried/embedded copper, thermal separation |
| Surface finish | ENIG / HASL / OSP / hard gold |
Aluminum and copper metal-base materials solve the heat dissipation bottleneck of high-power devices; combined with thermal separation structures, heat flows directly from hot pads to the metal layer — providing higher thermal reliability in LED, power module and automotive lighting applications.
| Capability item | Specification range |
|---|---|
| Metal base materials | Aluminum / copper base |
| Copper foil thickness | ≤ 6 OZ |
| Circuit layers | Single-sided / double-sided / metal-core multilayer |
| Thermal conductivity | 2 – 12 W/m·K |
| Thermal separation · insulated-layer conduction | 0.3 – 2 W/m·K |
| Thermal separation · surface thermal pads | Flush / recessed treatment |
| Thermal separation · copper base thickness | 0.8 – 3.2 mm |
| Special processes | Metal-core boards, local copper inlays, edge metallization |
High thermal conductivity insulation substrates for RF power amplifiers, laser devices and power semiconductor packaging. Alumina and aluminum nitride offer high thermal conductivity, insulation and temperature resistance, replacing conventional metal-base structures in miniaturized, high-frequency, high-power designs.
| Capability item | Specification range |
|---|---|
| Main materials | Al₂O₃ (alumina) / AlN (aluminum nitride) |
| Thermal conductivity | Al₂O₃ approx. 24 W/m·K; AlN up to 170 W/m·K |
| Fabrication process | DPC direct copper plating / thick-film printing |
| Line precision | Fine lines supporting high-density pad layouts |
| Temperature resistance | High temperature resistance and low CTE for thermal cycling |
| Typical structures | Single-sided / double-sided / multilayer co-fired structures |
Laminating FR-4 rigid zones with PI flex zones enables 3D routing, reduces connectors and solder joints, and improves assembly reliability and space utilization — widely used in medical, portable and precision camera module applications.
| Capability item | Specification range |
|---|---|
| Structure type | Single-/double-sided flex / multilayer rigid-flex |
| Material combination | FR-4 + PI (polyimide) hybrid lamination |
| Flexing type | Static / dynamic flexing (confirmed per design) |
| Layer count range | 2 – 16 layers (incl. rigid-flex multilayer) |
| Stiffener methods | FR-4 stiffeners, stainless steel / aluminum stiffeners, EMI shielding layers |
| Surface finish | ENIG / immersion tin / OSP / hard gold |
| Special processes | Stepped openings, half-holes, blind/buried vias, impedance control |
When standard structures cannot meet assembly or performance requirements, custom processes — stepped gold fingers, depth-controlled back drilling, half-holes, copper inlays and hybrid dielectrics — translate design intent into manufacturable boards. Early design-stage review is recommended for these types.
| Process item | Capability description |
|---|---|
| Stepped gold fingers | Board thickness ≥ 2.0 mm, gold finger thickness ≤ 1.6 ± 0.1 mm, slot precision ±0.05 mm |
| Depth-controlled back drilling | Back drill depth control with ±0.05 mm precision |
| Half-holes / metallized half-holes | Modular assembly and edge-mount processes |
| Metallized board edges | Edge metallization and shielding design |
| Buried copper / copper inlays | Local heavy copper and inlay thermal structures |
| Stepped mounting holes | Counterbored and countersunk structures |
| Hybrid dielectric lamination | Local hybrid lamination of materials with different Dk/Df |
| Max. layers (specialty structures) | 6 layers metal-base / up to 44 layers with stepped gold finger structures |