Shenzhen LingXin Technology Co., Ltd. — engineering capability for high-end board requirements, manufacturing discipline for consistent delivery.
Shenzhen LingXin Technology Co., Ltd. (AIPCB.cc) is a professional manufacturer ofhigh-density multilayer printed circuit boards and specialty boardsmanufacturer, providing the high-end electronics market withprototype validation to small and medium volume productionfull-range circuit board services.
Our products coverhigh multilayer, high-frequency high-speed, HDI and blind/buried via boards, high-TG heavy copper boards, metal-base (metal-core) boards, ceramic substrates, rigid-flex boardsand various specialty structure boards, widely used in AI servers and data centers, accelerator cards, optical communications, automotive electronics, industrial control, energy and power, medical devices, research institutions, defense and military high-tech fields.
With AI compute expanding rapidly, high layer counts, large sizes, high density and low loss have become common traits of high-end boards. We organize our engineering and manufacturing capabilities around these needs: introducing AI toolchains into quoting and DFM reviews, controlling impedance, registration and reliability with data, and keeping complex projects on a controllable process path from the start.
We insist ontechnology innovation driven, regarding process technology capability as our core competitiveness, and upholding“High, Precise, Special, Fast”as the business philosophy and practice an immediate-response service policy, taking “meeting customer needs” as our mission and providing stable technical support and product services to customers worldwide.
| Company name | Shenzhen LingXin Technology Co., Ltd. |
| Business platform | AIPCB.cc |
| Main business focus | High-end PCB manufacturing (multilayer and specialty boards) |
| Service model | Expedited prototypes · small/medium volumes · long-term supply |
| Company address | Shenzhen, Guangdong, China |
| ICP filing number | 粤ICP备2025391416号-2 |
Front-load engineering capability; keep risks before production starts.
From 2-layer prototypes to 32-layer high multilayer, from heavy copper to ceramic and rigid-flex — one window for multiple board types reduces multi-vendor coordination costs.
Toolchains complete DFM pre-checks, impedance and stackup simulations and process route matching, exposing manufacturability issues at the quoting stage.
Etch compensation and stackup control organized around target impedance and insertion loss, validated with TDR testing, helping high-speed links pass on the first try.
Expedited prototypes and volume scheduling are managed separately, with proactive progress updates at key milestones and immediate communication of solutions when issues arise.
Operations under ISO 9001 / ISO 14001 / IATF 16949, UL certification and RoHS compliance, with traceable inspection data.
Dedicated process parameter archives for long-term customers, supporting design optimization, alternative material evaluation and failure analysis.
Starting from standard double-sided and multilayer boards, gradually extending to high layer counts, high density and specialty materials — forming today's high-end-board-centered manufacturing capability.
Entering the market with double-sided and standard multilayer prototypes, establishing the basic flow of rapid sampling and engineering review.
Expanding layer limits and large-size fabrication, introducing heavy copper and high-TG materials to take on power and industrial control projects.
Building laser drilling and blind/buried via capability, introducing high-frequency high-speed materials and hybrid lamination, entering optical communications and automotive electronics.
For AI servers, accelerator cards and 224G high-speed links, integrating high multilayer, heavy copper, HDI and low-loss material solutions with AI-assisted engineering services.
Core processes are in-house with key inspection equipment in place, ensuring process windows and traceable data.
| Stage | Equipment & capability |
|---|---|
| Inner layer imaging | LDI laser direct imaging, fine line capability 3/3 mil |
| Lamination | Vacuum lamination with registration control for high multilayer and hybrid structures |
| Drilling | Mechanical + laser drilling, min. hole 0.10 mm |
| Hole metallization | Electroless copper + electroplating, hole copper 25–50 μm |
| Outer layer circuitry | Parallel process windows for heavy copper etching and fine lines |
| Solder mask & legend | LPI photoimageable solder mask + photoimageable legend, multiple colors |
| Surface finish | ENIG / immersion silver / immersion tin / OSP / HASL / hard gold |
| Testing | AOI, flying probe, TDR impedance, microsection, ionic contamination |
Treat every delivery as the starting point of a long-term partnership.
Business-day quotations and engineering questions receive a clear answer or action milestone within 24 hours.
Quotes detail layers, materials, surface finish and special processes; changes are itemized separately.
Inspection records kept per batch; microsection, impedance and dimensional reports available on request.
Supporting stackup optimization, material substitution and cost-down process suggestions; joining customer design reviews when needed.