Shenzhen LingXin Technology Co., Ltd. specializes in high-density multilayer and specialty board manufacturing. From 2–32-layer high-multilayer boards, high-frequency high-speed boards, HDI blind/buried vias to high-TG heavy copper, metal-base (metal-core) boards, ceramic substrates and rigid-flex boards, we deliver highly reliable PCBs — from prototypes to small and medium volumes — for AI server, accelerator card, optical module and automotive electronics customers.
Covering high multilayer, high-frequency high-speed, HDI, heavy copper, metal-base, ceramic and rigid-flex board types — fully in-house from prototype validation to small and medium volume production.
4–32 layers of high-density interconnect with precise impedance control, large-size thick backplane fabrication, and mature long/short gold finger and back-drilling processes.
High-frequency high-speed materials such as Rogers, Taconic and Panasonic M6/M7, with hybrid lamination and metal-base composite structures supporting 112G/224G high-speed links.
1–3 step laser blind vias, mechanical buried vias, via-in-pad and stacked via processes; fine lines enable high-density interconnect for miniaturized, high-IO designs.
1–13 OZ heavy copper with high-TG base materials carries high currents with excellent heat dissipation — ideal for power supplies, power devices and NEV control modules.
Aluminum and copper metal-base materials with thermal separation structures, thermal conductivity 2–12 W/m·K, solving the heat dissipation bottleneck of high-power devices.
Alumina / aluminum-nitride ceramic substrates with high thermal conductivity, high insulation and high temperature resistance — for RF power amplifiers, lasers and power semiconductor packaging.
Multilayer hybrid lamination of FR-4 and PI with reliable flexing and 3D routing, meeting interconnect needs inside portable devices and complex structures.
Custom structure solutions: stepped gold fingers, depth-controlled back drilling, half-holes and metallized half-holes, buried/embedded copper, thermal separation and hybrid dielectrics.
Our high-end boards serve applications with stringent reliability, signal integrity and thermal requirements — from compute infrastructure to industrial and medical sectors.
Embedding AI toolchains into quoting and engineering review makes early communication for high-end boards faster, more accurate and with less rework.
Automatic recognition of Gerber and stackup information with instant assessment of layers, size and process difficulty — less waiting for manual pricing.
Automatic checks of minimum line width, hole diameter, annular ring, spacing and impedance structures before fabrication, exposing manufacturability risks early.
Based on target impedance and loss requirements, we quickly recommend line width, dielectric thickness and stackup combinations, shortening the review cycle.
Automatically matching materials, surface finishes and special process routes to board type and performance needs, reducing trial-and-error costs.
High, Precise, Special, Fast — engineering capability for high-end requirements, manufacturing discipline for consistent delivery.
AI server and communication backplanes demand high layer counts, thick boards and small holes, with extreme requirements on lamination registration and drilling precision. Stable layer registration and depth-controlled back drilling ensure hole-wall quality and signal integrity at high aspect ratios.
From material selection and dielectric thickness control to etch compensation, processes are organized around target impedance and insertion loss requirements. Hybrid lamination, metal-base composites and low-loss materials all have mature solutions, helping high-speed links pass testing on the first try.
Heavy copper, metal-base, ceramic and rigid-flex boards demand narrow process windows. We build a closed loop from incoming inspection and process control to finished-product testing, with microsection, impedance and thermal shock validation to ensure batch consistency.
Dedicated engineers handle quotations, with clear milestone feedback for expedited prototypes and small/medium volume scheduling.
Industry updates, technology trends and company news.
Accelerated build-out of compute infrastructure is reshaping order structures for 20+ layer high-multilayer mainboards and heavy copper power boards — with early engineering review now the key to lead times.
From low-loss material selection to copper foil roughness control — a review of loss sources often overlooked in ultra-high-speed PCB design.
Simplified assembly and improved reliability through 3D routing are accelerating rigid-flex adoption in mid- and high-end medical devices.