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Centered on high multilayer, high-frequency high-speed, HDI and specialty boards, we cover 8 major categories of high-end PCB products. All board types support expedited prototypes and extension to small/medium volumes; capability parameters are detailed in each section below.

High Multilayer PCB high-frequency high-speed boards HDI / Blind & Buried Vias high-TG heavy copper metal-base (metal-core) boards ceramic substrates rigid-flex boards Specialty structures & processes
MULTILAYER PCB

High Multilayer PCB

Built for the high layer counts, large sizes and thick boards of AI servers, communication backplanes and industrial mainboards. Stable lamination registration, precise impedance control and mature back-drilling processes ensure hole-wall quality and signal consistency at high aspect ratios.

Full specifications & FAQ → AI server mainboardsCommunication backplanesIndustrial control mainboardsMedical equipment
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HIGH FREQUENCY / HIGH SPEED PCB

high-frequency high-speed boards

Serving high-frequency high-speed links such as 800G/1.6T optical modules, 5G communications and radar. Low-loss materials, hybrid lamination and metal-base composites — combined with line width precision and copper foil roughness control — keep insertion loss within the design window.

Full specifications & FAQ → 800G / 1.6T optical modules5G base stationsMillimeter-wave radarSatellite communications
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HDI · BLIND & BURIED VIAS

HDI boards / blind-buried via boards

High-density interconnect via laser blind vias, mechanical buried vias and via-in-pad frees routing space for accelerator cards, optical modules and compact terminals. Supports 1+N+1 / 2+N+2 / 3+N+3 build-ups with staggered and stacked via combinations; 1–3 step structures in stable volume production, while any-layer interconnect (ELIC) and higher step counts are reviewed per project — meeting high-IO-density and short-interconnect design needs.

Full specifications & FAQ → AI accelerator cardsOptical modulesWearable devicesIoT modules5G communicationsAutomotive electronics
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HIGH TG HEAVY COPPER PCB

High-TG Heavy Copper PCB

Designed for power busbars, power devices and NEV control electronics. 1–13 OZ heavy copper carries high currents while high-TG materials improve heat resistance and dimensional stability; combinations of outer heavy copper and base copper meet demanding current and thermal requirements.

Full process parameters & technical features
Capability itemSpecification range
Copper thickness range1 – 13 OZ (outer base copper up to 18 OZ)
Base material TgTg 150 / 170 / 180 ℃
Board thickness range0.6 – 8.0 mm
Min. line width / spacing≥ 4 / 4 mil (adjusted with copper thickness)
Max. layers (heavy copper structures)16 layers
Product certificationsUL / RoHS
Special processesLocal heavy copper, buried/embedded copper, thermal separation
Surface finishENIG / HASL / OSP / hard gold
✓Technical highlights
  • Ultra-heavy copper busbar fabrication, 1–13 OZ multilayer boards
  • Heavy copper etching and resin fill control to avoid voids
  • Various high-TG, thermally conductive insulation materials available
  • Local copper inlays and buried copper improve heat dissipation
  • UL certified, suitable for long-term high-load operation
Power busbarsNEV motor control electronicsPower modulesIndustrial power supplies
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METAL BASE / CORE PCB

metal-base (metal-core) boards

Aluminum and copper metal-base materials solve the heat dissipation bottleneck of high-power devices; combined with thermal separation structures, heat flows directly from hot pads to the metal layer — providing higher thermal reliability in LED, power module and automotive lighting applications.

Full process parameters & technical features
Capability itemSpecification range
Metal base materialsAluminum / copper base
Copper foil thickness≤ 6 OZ
Circuit layersSingle-sided / double-sided / metal-core multilayer
Thermal conductivity2 – 12 W/m·K
Thermal separation · insulated-layer conduction0.3 – 2 W/m·K
Thermal separation · surface thermal padsFlush / recessed treatment
Thermal separation · copper base thickness0.8 – 3.2 mm
Special processesMetal-core boards, local copper inlays, edge metallization
✓Technical highlights
  • Aluminum / copper base options selected by thermal budget
  • Thermal separation with flush or recessed thermal pads
  • Metal-core multilayer design and fabrication experience
  • High-withstand-voltage insulation balancing cooling and electrical safety
  • Composite with high-frequency materials for combined RF + thermal performance
LED lightingHigh-power modulesAutomotive lightingPower adapters
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CERAMIC SUBSTRATE

ceramic substrates

High thermal conductivity insulation substrates for RF power amplifiers, laser devices and power semiconductor packaging. Alumina and aluminum nitride offer high thermal conductivity, insulation and temperature resistance, replacing conventional metal-base structures in miniaturized, high-frequency, high-power designs.

Full process parameters & technical features
Capability itemSpecification range
Main materialsAl₂O₃ (alumina) / AlN (aluminum nitride)
Thermal conductivityAl₂O₃ approx. 24 W/m·K; AlN up to 170 W/m·K
Fabrication processDPC direct copper plating / thick-film printing
Line precisionFine lines supporting high-density pad layouts
Temperature resistanceHigh temperature resistance and low CTE for thermal cycling
Typical structuresSingle-sided / double-sided / multilayer co-fired structures
✓Technical highlights
  • High thermal conductivity: AlN materials handle high power density cooling
  • High dielectric strength for high-voltage power scenarios
  • Low CTE with good chip matching
  • Supports fine lines combined with heavy copper conductors
RF power amplifiersLaser devicesPower semiconductorsAerospace
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RIGID-FLEX PCB

rigid-flex boards

Laminating FR-4 rigid zones with PI flex zones enables 3D routing, reduces connectors and solder joints, and improves assembly reliability and space utilization — widely used in medical, portable and precision camera module applications.

Full process parameters & technical features
Capability itemSpecification range
Structure typeSingle-/double-sided flex / multilayer rigid-flex
Material combinationFR-4 + PI (polyimide) hybrid lamination
Flexing typeStatic / dynamic flexing (confirmed per design)
Layer count range2 – 16 layers (incl. rigid-flex multilayer)
Stiffener methodsFR-4 stiffeners, stainless steel / aluminum stiffeners, EMI shielding layers
Surface finishENIG / immersion tin / OSP / hard gold
Special processesStepped openings, half-holes, blind/buried vias, impedance control
✓Technical highlights
  • Mature rigid-flex design and hybrid lamination processes
  • 3D routing reduces connectors and improves system reliability
  • Stiffener and shielding solutions customizable per structure
  • Suited to slim designs and multi-height assemblies
Medical electronicsPortable devicesCamera modulesIndustrial control systems
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SPECIAL PCB & PROCESS

Specialty Structure & Process Boards

When standard structures cannot meet assembly or performance requirements, custom processes — stepped gold fingers, depth-controlled back drilling, half-holes, copper inlays and hybrid dielectrics — translate design intent into manufacturable boards. Early design-stage review is recommended for these types.

Full process parameters & technical features
Process itemCapability description
Stepped gold fingersBoard thickness ≥ 2.0 mm, gold finger thickness ≤ 1.6 ± 0.1 mm, slot precision ±0.05 mm
Depth-controlled back drillingBack drill depth control with ±0.05 mm precision
Half-holes / metallized half-holesModular assembly and edge-mount processes
Metallized board edgesEdge metallization and shielding design
Buried copper / copper inlaysLocal heavy copper and inlay thermal structures
Stepped mounting holesCounterbored and countersunk structures
Hybrid dielectric laminationLocal hybrid lamination of materials with different Dk/Df
Max. layers (specialty structures)6 layers metal-base / up to 44 layers with stepped gold finger structures
✓Common combinations
  • High multilayer + back drilling + long/short gold fingers (communication backplanes)
  • HDI + via-in-pad + impedance control (accelerator cards)
  • Heavy copper + copper inlays + high TG (power modules)
  • Metal base + high-frequency hybrid lamination (high-frequency power devices)
  • Rigid-flex + impedance control (medical and portable devices)
Communication backplanesAI accelerator cardsPower modulesDefense & military
Evaluate specialty structure options

No exact match for your board type?

High-end board requirements often call for custom process routes. Send us your drawings and performance requirements — our engineering team will provide a manufacturability assessment and process recommendations.

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