MULTILAYER PCB
Models and specifications
High-speed back-drilled board
Depth-controlled back drilling · hybrid lamination and metal-base composites
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High-density multilayer board
Up to 44 layers · min. line width 3/3 mil
Get a quote for this productFull process parameters & technical features
| Capability item | Specification range |
|---|---|
| Layer count range | 4 – 44 layers |
| Finished board thickness | 0.4 – 8.0 mm |
| Max. fabrication size | 610 × 1100 mm |
| Min. line width / spacing | 3 / 3 mil (2 / 2 mil for HDI) |
| Min. finished hole diameter | Mechanical holes 0.15 mm |
| Max. aspect ratio | 20:1 (25:1 for backplane structures) |
| Impedance control | ±8% (±10% standard) |
| Surface finish | ENIG / immersion silver / immersion tin / OSP / HASL / hard gold |
✓Technical highlights
- High-multilayer fabrication with stable layer registration
- Precise impedance control for multiple differential and single-ended requirements
- Large-size and thick backplane fabrication capability
- Various specialty materials and hybrid dielectric lamination
- Special processes: long/short gold fingers, back drilling, stepped slots
AI server mainboardsCommunication backplanesIndustrial control mainboardsMedical equipment
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