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Gerber files (RS-274X)
Including all copper layers, solder mask, legend and outline; please provide drill files separately
Stackup structure
Layer count, dielectric thickness, target impedance and allowed tolerance
Quantity, board thickness and size
Prototype quantity and expected follow-on volumes, for tiered pricing
Surface finish & material requirements
Whether specific laminates (e.g. Rogers), ENIG thickness or hard gold areas are required
Special processes & acceptance criteria
Back drilling, via-in-pad, half-holes, impedance testing, IPC-A-600 Class level, etc.
Lead time & certification requirements
Whether UL markings, IATF-related documents or shipment reports are needed

Two tracks by board complexity: standard double-sided / multilayer boards run the quick-turn lane; HDI, high layer count, impedance and high-speed boards run the EQ-first lane. On both tracks the lead time starts from sign-off of the manufacturing files.

1. You provide Gerber + specifications (material, copper weight, finish, quantity)
2. Intake & quick DFM pre-check (screening for critical issues)
3. Direct quotation (P/I) — no formal EQ questionnaire at this stage
4. Quote confirmed, order placed, deposit paid
5. Formal engineering EQ (panelization, stackup, impedance, process questions) — you sign off the EQ
6. After EQ sign-off we generate the MI and return the manufacturing files for your confirmation (ECO / engineering confirmation)
7. Files signed off → production starts; lead time counts from this point
8. Production, electrical test & AOI; shipment with test reports

The standard high-end commercial flow for overseas and Taiwan research customers.

1. Requirements: send Gerber, stackup / impedance targets, board spec, quantity, application and acceptance criteria; NDA available
2. Engineering pre-review (EQ): a full DFM audit producing an EQ document covering process risks, stackup proposal, impedance feasibility and special-process constraints
3. Quotation: once the EQ is fully agreed and signed, we issue the formal itemized quote with committed lead time and quality standard
4. Order & payment: purchase order / contract and deposit
5. Second engineering confirmation: after payment we create the MI, panelize and generate production artwork, returning the final manufacturing files for your review and sign-off
6. Production release: production starts upon file sign-off — lead time counts from this node (standard practice among high-end fabs)
7. Build, test & deliver: in-process feedback; shipment with electrical test report, AOI, cross-section / impedance reports (as needed) and after-sales engineering support

On complex boards many parameters are still undefined — quoting before EQ risks missed processes and later price increases. That is the core difference between the two tracks.