HDI PCB and Blind/Buried Via Boards

High-density interconnect via laser blind vias, mechanical buried vias and via-in-pad frees routing space for accelerator cards, optical modules and compact terminals. Supports 1+N+1 / 2+N+2 / 3+N+3 build-ups with staggered and stacked via combinations; 1–3 step structures in stable volume production, while any-layer interconnect (ELIC) and higher step counts are reviewed per project — meeting high-IO-density and short-interconnect design needs.

Laser blind vias down to 0.10 mm at 1:1 aspect ratio, stacked-via registration ±0.05 mm, HDI line width and spacing 2/2 mil on LDI. Stackups from 1+N+1 to 3+N+3 run in stable volume; any-layer and cross-step interconnect go through project engineering review.